SM411 
Placement Speed
  - Chip 42K CPH (IPC9850)
Applicable Parts 
  - Max. 0402 ~ ∴14mm 
    (Part height H=12mm)
Placement Accuracy 
  - Chip/IC 【50Л (Cpk 1.0)
Applicable PCBs 
  - L460 x W250 x 2Lane 
    (Standard) 
  - L510 x W460 x 1Lane 
    (Standard) 
  - Max. L610 x W460 x 1Lane
SM411 
贴装速度 
  - Chip 42K CPH (IPC9850)
对应元器件
  - Max. 0402 ~ □14mm 
    (元器件高度 H=12mm)
贴装精度
  - Chip/IC ±50? (Cpk 1.0)
PCB尺寸
  - L460 x W250 x 2Lane(标准) 
  - L510 x W460 x 1Lane(标准) 
  - Max. L610 x W460 x 1Lane
Dynamic Chip Shooter

The SM411 has achieved the highest placement speed of 42,000 CPH for chips and 30,000 CPH for SOP parts (based on IPC, respectively) in the world among machines of the same class by adopting a dual gantry mechanism
and On-The-Fly method, for which Samsung registered patents. 

In addition, by implementing high accuracy placement of 50 microns at high speed, it allows placement of parts from the smallest 0402 chip to ∴14mm IC part. In the aspect of PCB applicability, it allows simultaneous feeding of 2 L460 x W250 PCBs,
increasing actual productivity. 

It also supports the production of L610mm long board for display as an option. 
Dynamic Chip Shooter

SM411采用实现中速机的最快速贴装的三星专利On The Fly识别方式，以及双悬臂结构，从而达到芯片元器件42,000 CPH、SOP元器件30,000 CPH(各IPC标准)在同类产品中拥有世界最快速的贴片速度。并且，其在高速中也能实行50微米的高精度贴片，从而从最小0402芯片到最大□14mmIC元器件为止，皆可以实行贴片工序。在PCB对应力方面，它能同时投入二张L460 x W250PCB，从而提高了生产效率，并也附加支持生产显示器用L610mm的长板。